1N5809US
vs
1N5809US
feature comparison
| Rohs Code |
No
|
|
| Part Life Cycle Code |
Active
|
Transferred
|
| Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
M/A-COM TECHNOLOGY SOLUTIONS INC
|
| Package Description |
HERMETIC SEALED, GLASS, MELF-2
|
|
| Reach Compliance Code |
compliant
|
compliant
|
| Factory Lead Time |
24 Weeks
|
|
| Samacsys Manufacturer |
Microchip
|
|
| Additional Feature |
HIGH RELIABILITY, METALLURGICALLY BONDED
|
|
| Application |
ULTRA FAST RECOVERY
|
ULTRA FAST RECOVERY POWER
|
| Case Connection |
ISOLATED
|
ISOLATED
|
| Configuration |
SINGLE
|
SINGLE
|
| Diode Element Material |
SILICON
|
SILICON
|
| Diode Type |
RECTIFIER DIODE
|
RECTIFIER DIODE
|
| JESD-30 Code |
O-LELF-R2
|
O-LELF-R2
|
| JESD-609 Code |
e0
|
|
| Non-rep Pk Forward Current-Max |
125 A
|
125 A
|
| Number of Elements |
1
|
1
|
| Number of Phases |
1
|
1
|
| Number of Terminals |
2
|
2
|
| Operating Temperature-Max |
175 °C
|
|
| Operating Temperature-Min |
-65 °C
|
|
| Output Current-Max |
3 A
|
3 A
|
| Package Body Material |
GLASS
|
GLASS
|
| Package Shape |
ROUND
|
ROUND
|
| Package Style |
LONG FORM
|
LONG FORM
|
| Rep Pk Reverse Voltage-Max |
100 V
|
100 V
|
| Reverse Recovery Time-Max |
0.03 µs
|
0.03 µs
|
| Surface Mount |
YES
|
YES
|
| Terminal Finish |
TIN LEAD OVER NICKEL
|
|
| Terminal Form |
WRAP AROUND
|
WRAP AROUND
|
| Terminal Position |
END
|
END
|
| Base Number Matches |
7
|
5
|
| ECCN Code |
|
EAR99
|
| HTS Code |
|
8541.10.00.80
|
|
|
|
Compare 1N5809US with alternatives
Compare 1N5809US with alternatives