1N5809E3
vs
1N5809R
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Active
Transferred
Ihs Manufacturer
MICROCHIP TECHNOLOGY INC
MICROSEMI CORP
Package Description
ROHS COMPLIANT, HERMETIC SEALED, GLASS, B PACKAGE-2
O-LALF-W2
Reach Compliance Code
compliant
compliant
Factory Lead Time
24 Weeks
Samacsys Manufacturer
Microchip
Additional Feature
HIGH RELIABILITY
Application
ULTRA FAST RECOVERY POWER
FAST RECOVERY
Case Connection
ISOLATED
ISOLATED
Configuration
SINGLE
SINGLE
Diode Element Material
SILICON
SILICON
Diode Type
RECTIFIER DIODE
RECTIFIER DIODE
Forward Voltage-Max (VF)
0.875 V
JESD-30 Code
O-LALF-W2
O-LALF-W2
JESD-609 Code
e3
e0
Non-rep Pk Forward Current-Max
125 A
125 A
Number of Elements
1
1
Number of Phases
1
1
Number of Terminals
2
2
Operating Temperature-Max
175 °C
Operating Temperature-Min
-65 °C
Output Current-Max
3 A
6 A
Package Body Material
GLASS
GLASS
Package Shape
ROUND
ROUND
Package Style
LONG FORM
LONG FORM
Rep Pk Reverse Voltage-Max
100 V
Reverse Current-Max
5 µA
Reverse Recovery Time-Max
0.03 µs
0.03 µs
Surface Mount
NO
NO
Technology
AVALANCHE
Terminal Finish
MATTE TIN OVER NICKEL
TIN LEAD
Terminal Form
WIRE
WIRE
Terminal Position
AXIAL
AXIAL
Base Number Matches
2
2
Pbfree Code
ECCN Code
EAR99
HTS Code
8541.10.00.80
Qualification Status
Not Qualified
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