1N5806USE3
vs
1N5806U02A
feature comparison
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
STMICROELECTRONICS
|
| Package Description |
HERMETIC SEALED, GLASS, D-5A, 2 PIN
|
ROHS COMPLIANT, HERMETIC SEALED, LCC2A, 2 PIN
|
| Reach Compliance Code |
compliant
|
compliant
|
| Factory Lead Time |
24 Weeks
|
26 Weeks, 5 Days
|
| Samacsys Manufacturer |
Microchip
|
STMicroelectronics
|
| Additional Feature |
HIGH RELIABLITY
|
FREE WHEELING DIODE
|
| Application |
ULTRA FAST RECOVERY
|
POWER ULTRA FAST RECOVERY
|
| Case Connection |
ISOLATED
|
|
| Configuration |
SINGLE
|
SINGLE
|
| Diode Element Material |
SILICON
|
SILICON
|
| Diode Type |
RECTIFIER DIODE
|
RECTIFIER DIODE
|
| Forward Voltage-Max (VF) |
0.875 V
|
0.8 V
|
| JESD-30 Code |
O-LELF-R2
|
R-XBCC-N2
|
| JESD-609 Code |
e3
|
|
| Non-rep Pk Forward Current-Max |
35 A
|
35 A
|
| Number of Elements |
1
|
1
|
| Number of Phases |
1
|
1
|
| Number of Terminals |
2
|
2
|
| Operating Temperature-Max |
175 °C
|
175 °C
|
| Operating Temperature-Min |
-65 °C
|
|
| Output Current-Max |
1 A
|
2.5 A
|
| Package Body Material |
GLASS
|
UNSPECIFIED
|
| Package Shape |
ROUND
|
RECTANGULAR
|
| Package Style |
LONG FORM
|
CHIP CARRIER
|
| Rep Pk Reverse Voltage-Max |
150 V
|
150 V
|
| Reverse Recovery Time-Max |
0.025 µs
|
0.03 µs
|
| Surface Mount |
YES
|
YES
|
| Technology |
AVALANCHE
|
|
| Terminal Finish |
MATTE TIN
|
|
| Terminal Form |
WRAP AROUND
|
NO LEAD
|
| Terminal Position |
END
|
BOTTOM
|
| Base Number Matches |
2
|
1
|
| Pin Count |
|
2
|
| ECCN Code |
|
EAR99
|
| HTS Code |
|
8541.10.00.80
|
| Peak Reflow Temperature (Cel) |
|
NOT SPECIFIED
|
| Qualification Status |
|
Not Qualified
|
| Time@Peak Reflow Temperature-Max (s) |
|
NOT SPECIFIED
|
|
|
|
Compare 1N5806USE3 with alternatives
Compare 1N5806U02A with alternatives