1N5806UA1
vs
JANTXV1N5806US
feature comparison
Part Life Cycle Code |
Active
|
Transferred
|
Ihs Manufacturer |
STMICROELECTRONICS
|
SEMTECH CORP
|
Package Description |
ROHS COMPLIANT, HERMETIC SEALED, LCC2A, 2 PIN
|
HERMETIC SEALED PACKAGE-2
|
Pin Count |
2
|
2
|
Reach Compliance Code |
compliant
|
unknown
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8541.10.00.80
|
8541.10.00.80
|
Samacsys Manufacturer |
STMicroelectronics
|
SEMTECH
|
Additional Feature |
FREE WHEELING DIODE
|
|
Application |
POWER ULTRA FAST RECOVERY
|
SUPER FAST SOFT RECOVERY
|
Configuration |
SINGLE
|
SINGLE
|
Diode Element Material |
SILICON
|
SILICON
|
Diode Type |
RECTIFIER DIODE
|
RECTIFIER DIODE
|
Forward Voltage-Max (VF) |
0.8 V
|
0.875 V
|
JESD-30 Code |
R-XBCC-N2
|
O-LELF-R2
|
Non-rep Pk Forward Current-Max |
35 A
|
35 A
|
Number of Elements |
1
|
1
|
Number of Phases |
1
|
1
|
Number of Terminals |
2
|
2
|
Operating Temperature-Max |
175 °C
|
175 °C
|
Output Current-Max |
2.5 A
|
2.5 A
|
Package Body Material |
UNSPECIFIED
|
GLASS
|
Package Shape |
RECTANGULAR
|
ROUND
|
Package Style |
CHIP CARRIER
|
LONG FORM
|
Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
|
Qualification Status |
Not Qualified
|
Qualified
|
Rep Pk Reverse Voltage-Max |
150 V
|
150 V
|
Reverse Recovery Time-Max |
0.03 µs
|
0.02 µs
|
Surface Mount |
YES
|
YES
|
Terminal Form |
NO LEAD
|
WRAP AROUND
|
Terminal Position |
BOTTOM
|
END
|
Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
Base Number Matches |
1
|
1
|
Factory Lead Time |
|
100 Weeks
|
Case Connection |
|
ISOLATED
|
Reference Standard |
|
MIL-19500/477
|
|
|
|
Compare 1N5806UA1 with alternatives
Compare JANTXV1N5806US with alternatives