1N5804US/TR
vs
1N6075
feature comparison
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROCHIP TECHNOLOGY INC
|
| Package Description |
HERMETIC SEALED, GLASS, A, 2 PIN
|
HERMETIC SEALED, GLASS, A PACKAGE-2
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
|
| HTS Code |
8541.10.00.80
|
|
| Factory Lead Time |
24 Weeks
|
24 Weeks
|
| Additional Feature |
HIGH RELIABILITY
|
HIGH RELIABILITY
|
| Application |
ULTRA FAST RECOVERY
|
GENERAL PURPOSE
|
| Breakdown Voltage-Min |
110 V
|
|
| Case Connection |
ISOLATED
|
ISOLATED
|
| Configuration |
SINGLE
|
SINGLE
|
| Diode Element Material |
SILICON
|
SILICON
|
| Diode Type |
RECTIFIER DIODE
|
RECTIFIER DIODE
|
| Forward Voltage-Max (VF) |
0.975 V
|
|
| JESD-30 Code |
O-LELF-R2
|
O-LALF-W2
|
| JESD-609 Code |
e0
|
e0
|
| Non-rep Pk Forward Current-Max |
35 A
|
|
| Number of Elements |
1
|
1
|
| Number of Phases |
1
|
1
|
| Number of Terminals |
2
|
2
|
| Operating Temperature-Max |
175 °C
|
155 °C
|
| Operating Temperature-Min |
-65 °C
|
-65 °C
|
| Output Current-Max |
2.5 A
|
0.85 A
|
| Package Body Material |
GLASS
|
GLASS
|
| Package Shape |
ROUND
|
ROUND
|
| Package Style |
LONG FORM
|
LONG FORM
|
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Rep Pk Reverse Voltage-Max |
100 V
|
150 V
|
| Reverse Current-Max |
1 µA
|
|
| Reverse Recovery Time-Max |
0.025 µs
|
0.03 µs
|
| Reverse Test Voltage |
100 V
|
|
| Surface Mount |
YES
|
NO
|
| Terminal Finish |
TIN LEAD
|
TIN LEAD
|
| Terminal Form |
WRAP AROUND
|
WIRE
|
| Terminal Position |
END
|
AXIAL
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
| Base Number Matches |
4
|
5
|
| Rohs Code |
|
No
|
| Samacsys Manufacturer |
|
Microchip
|
| Reference Standard |
|
MIL-19500/503
|
| Technology |
|
AVALANCHE
|
|
|
|
Compare 1N5804US/TR with alternatives
Compare 1N6075 with alternatives