1N5623US
vs
JAN1N5623US
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Transferred
Active
Ihs Manufacturer
MICROSEMI CORP
MICROCHIP TECHNOLOGY INC
Package Description
HERMETIC SEALED, GLASS, D-5A, 2 PIN
HERMETIC SEALED, GLASS PACKAGE-2
Pin Count
2
Reach Compliance Code
unknown
compliant
ECCN Code
EAR99
HTS Code
8541.10.00.80
Samacsys Manufacturer
Microsemi Corporation
Additional Feature
HIGH RELIABILITY
Application
GENERAL PURPOSE
GENERAL PURPOSE
Case Connection
ISOLATED
ISOLATED
Configuration
SINGLE
SINGLE
Diode Element Material
SILICON
SILICON
Diode Type
RECTIFIER DIODE
RECTIFIER DIODE
JESD-30 Code
O-LELF-R2
O-LELF-R2
JESD-609 Code
e0
Number of Elements
1
1
Number of Phases
1
1
Number of Terminals
2
2
Output Current-Max
1 A
1 A
Package Body Material
GLASS
GLASS
Package Shape
ROUND
ROUND
Package Style
LONG FORM
LONG FORM
Qualification Status
Not Qualified
Qualified
Reverse Recovery Time-Max
0.5 µs
0.5 µs
Surface Mount
YES
YES
Terminal Finish
TIN LEAD
Terminal Form
WRAP AROUND
WRAP AROUND
Terminal Position
END
END
Base Number Matches
5
2
Reference Standard
MIL-19500/429J
Compare 1N5623US with alternatives
Compare JAN1N5623US with alternatives