1N5617US
vs
JAN1N5617US
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Active
Transferred
Ihs Manufacturer
MICROCHIP TECHNOLOGY INC
MICROSEMI CORP
Package Description
HERMETIC SEALED, GLASS, D-5A, 2 PIN
HERMETIC SEALED, GLASS PACKAGE-2
Reach Compliance Code
compliant
unknown
Factory Lead Time
24 Weeks
Additional Feature
HIGH RELIABILITY
Application
GENERAL PURPOSE
GENERAL PURPOSE
Case Connection
ISOLATED
ISOLATED
Configuration
SINGLE
SINGLE
Diode Element Material
SILICON
SILICON
Diode Type
RECTIFIER DIODE
RECTIFIER DIODE
JESD-30 Code
O-LELF-R2
O-LELF-R2
JESD-609 Code
e0
Number of Elements
1
1
Number of Phases
1
1
Number of Terminals
2
2
Operating Temperature-Max
175 °C
175 °C
Operating Temperature-Min
-65 °C
-65 °C
Output Current-Max
1 A
1 A
Package Body Material
GLASS
GLASS
Package Shape
ROUND
ROUND
Package Style
LONG FORM
LONG FORM
Qualification Status
Not Qualified
Not Qualified
Reverse Recovery Time-Max
0.15 µs
0.15 µs
Surface Mount
YES
YES
Technology
AVALANCHE
Terminal Finish
TIN LEAD
Terminal Form
WRAP AROUND
WRAP AROUND
Terminal Position
END
END
Base Number Matches
7
1
Pin Count
2
ECCN Code
EAR99
HTS Code
8541.10.00.80
Forward Voltage-Max (VF)
1.6 V
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Reference Standard
MIL-19500/429J
Rep Pk Reverse Voltage-Max
400 V
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Compare 1N5617US with alternatives
Compare JAN1N5617US with alternatives