1N5617FX
vs
BYD33G
feature comparison
Part Life Cycle Code |
Transferred
|
Obsolete
|
Ihs Manufacturer |
SEMTECH CORP
|
NXP SEMICONDUCTORS
|
Package Description |
O-XALF-W2
|
HERMETIC SEALED, GLASS PACKAGE-2
|
Pin Count |
2
|
2
|
Reach Compliance Code |
unknown
|
unknown
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8541.10.00.80
|
8541.10.00.80
|
Application |
GENERAL PURPOSE
|
|
Case Connection |
ISOLATED
|
ISOLATED
|
Configuration |
SINGLE
|
SINGLE
|
Diode Element Material |
SILICON
|
SILICON
|
Diode Type |
RECTIFIER DIODE
|
RECTIFIER DIODE
|
JESD-30 Code |
O-XALF-W2
|
O-LALF-W2
|
Number of Elements |
1
|
1
|
Number of Phases |
1
|
1
|
Number of Terminals |
2
|
2
|
Output Current-Max |
1 A
|
1.3 A
|
Package Body Material |
UNSPECIFIED
|
GLASS
|
Package Shape |
ROUND
|
ROUND
|
Package Style |
LONG FORM
|
LONG FORM
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Rep Pk Reverse Voltage-Max |
400 V
|
400 V
|
Reverse Recovery Time-Max |
0.15 µs
|
0.25 µs
|
Surface Mount |
NO
|
NO
|
Terminal Form |
WIRE
|
WIRE
|
Terminal Position |
AXIAL
|
AXIAL
|
Base Number Matches |
1
|
8
|
Rohs Code |
|
No
|
Forward Voltage-Max (VF) |
|
1.3 V
|
Non-rep Pk Forward Current-Max |
|
20 A
|
Operating Temperature-Max |
|
175 °C
|
Operating Temperature-Min |
|
-65 °C
|
Reference Standard |
|
IEC-134
|
Technology |
|
AVALANCHE
|
|
|
|
Compare 1N5617FX with alternatives