1N5616
vs
1F4-BP
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
BKC SEMICONDUCTORS INC
MICRO COMMERCIAL COMPONENTS CORP
Package Description
MICRO MINIATURE, GLASS PACKAGE-2
O-PALF-W2
Reach Compliance Code
unknown
not_compliant
Case Connection
ISOLATED
ISOLATED
Configuration
SINGLE
SINGLE
Diode Element Material
SILICON
SILICON
Diode Type
RECTIFIER DIODE
RECTIFIER DIODE
Forward Voltage-Max (VF)
1.2 V
JESD-30 Code
O-LALF-W2
O-PALF-W2
JESD-609 Code
e0
e3
Non-rep Pk Forward Current-Max
50 A
30 A
Number of Elements
1
1
Number of Phases
1
1
Number of Terminals
2
2
Operating Temperature-Max
175 °C
Operating Temperature-Min
-65 °C
Output Current-Max
1 A
1 A
Package Body Material
GLASS
PLASTIC/EPOXY
Package Shape
ROUND
ROUND
Package Style
LONG FORM
LONG FORM
Qualification Status
Not Qualified
Not Qualified
Rep Pk Reverse Voltage-Max
400 V
400 V
Reverse Recovery Time-Max
2 µs
0.15 µs
Surface Mount
NO
NO
Terminal Finish
Tin/Lead (Sn/Pb)
MATTE TIN
Terminal Form
WIRE
WIRE
Terminal Position
AXIAL
AXIAL
Base Number Matches
17
1
Pbfree Code
Pin Count
2
ECCN Code
EAR99
HTS Code
8541.10.00.80
Application
GENERAL PURPOSE
Moisture Sensitivity Level
1
Peak Reflow Temperature (Cel)
260
Time@Peak Reflow Temperature-Max (s)
10
Compare 1F4-BP with alternatives