1N5615/TR
vs
1N5615
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Active
Obsolete
Ihs Manufacturer
MICROCHIP TECHNOLOGY INC
CENTRAL SEMICONDUCTOR CORP
Package Description
HERMETIC SEALED, GLASS, A, 2 PIN
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8541.10.00.80
8541.10.00.80
Factory Lead Time
24 Weeks
Additional Feature
HIGH RELIABILITY, METALLURGICALLY BONDED
Application
GENERAL PURPOSE
GENERAL PURPOSE
Case Connection
ISOLATED
ISOLATED
Configuration
SINGLE
SINGLE
Diode Element Material
SILICON
SILICON
Diode Type
RECTIFIER DIODE
RECTIFIER DIODE
JESD-30 Code
O-LALF-W2
E-PALF-W2
JESD-609 Code
e0
e0
Number of Elements
1
1
Number of Phases
1
1
Number of Terminals
2
2
Operating Temperature-Max
175 °C
200 °C
Operating Temperature-Min
-65 °C
Output Current-Max
1 A
1 A
Package Body Material
GLASS
PLASTIC/EPOXY
Package Shape
ROUND
ELLIPTICAL
Package Style
LONG FORM
LONG FORM
Qualification Status
Not Qualified
Not Qualified
Rep Pk Reverse Voltage-Max
200 V
200 V
Reverse Recovery Time-Max
0.15 µs
0.15 µs
Surface Mount
NO
NO
Technology
AVALANCHE
Terminal Finish
TIN LEAD
TIN LEAD
Terminal Form
WIRE
WIRE
Terminal Position
AXIAL
AXIAL
Base Number Matches
1
17
Forward Voltage-Max (VF)
1.2 V
Non-rep Pk Forward Current-Max
50 A
Compare 1N5615/TR with alternatives
Compare 1N5615 with alternatives