1N5613 vs JANTXV1N5613 feature comparison

1N5613 Microchip Technology Inc

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JANTXV1N5613 Microsemi Corporation

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Rohs Code No No
Part Life Cycle Code Active Transferred
Ihs Manufacturer MICROCHIP TECHNOLOGY INC MICROSEMI CORP
Package Description HERMETICALLY SEALED, GLASS PACKAGE-2
Reach Compliance Code compliant unknown
Factory Lead Time 28 Weeks
Additional Feature HIGH RELIABILITY, METALLURGICALLY BONDED
Breakdown Voltage-Min 191 V 191 V
Case Connection ISOLATED ISOLATED
Clamping Voltage-Max 265 V
Configuration SINGLE SINGLE
Diode Element Material SILICON SILICON
Diode Type TRANS VOLTAGE SUPPRESSOR DIODE TRANS VOLTAGE SUPPRESSOR DIODE
JESD-30 Code O-LALF-W2 O-XALF-W2
Non-rep Peak Rev Power Dis-Max 1500 W 1500 W
Number of Elements 1 1
Number of Terminals 2 2
Operating Temperature-Max 175 °C
Operating Temperature-Min -65 °C
Package Body Material GLASS UNSPECIFIED
Package Shape ROUND ROUND
Package Style LONG FORM LONG FORM
Peak Reflow Temperature (Cel) NOT SPECIFIED
Polarity UNIDIRECTIONAL UNIDIRECTIONAL
Power Dissipation-Max 3 W 3 W
Qualification Status Not Qualified Not Qualified
Rep Pk Reverse Voltage-Max 175 V 175 V
Reverse Current-Max 5 µA
Surface Mount NO NO
Technology AVALANCHE AVALANCHE
Terminal Form WIRE WIRE
Terminal Position AXIAL AXIAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Base Number Matches 4 1
Pbfree Code No
ECCN Code EAR99
HTS Code 8541.10.00.50
JESD-609 Code e0
Reference Standard MIL-19500/434C
Terminal Finish TIN LEAD

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Compare JANTXV1N5613 with alternatives