1N5610E3
vs
MQLC33TR
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Active
Transferred
Ihs Manufacturer
MICROCHIP TECHNOLOGY INC
MICROSEMI CORP
Package Description
HERMETICALLY SEALED, GLASS PACKAGE-2
O-MALF-W2
Reach Compliance Code
compliant
compliant
Factory Lead Time
21 Weeks
Additional Feature
HIGH RELIABILITY, METALLURGICALLY BONDED
Breakdown Voltage-Min
33 V
36.7 V
Case Connection
ISOLATED
CATHODE
Configuration
SINGLE
SINGLE
Diode Element Material
SILICON
SILICON
Diode Type
TRANS VOLTAGE SUPPRESSOR DIODE
TRANS VOLTAGE SUPPRESSOR DIODE
JESD-30 Code
O-LALF-W2
O-MALF-W2
Non-rep Peak Rev Power Dis-Max
1500 W
1500 W
Number of Elements
1
1
Number of Terminals
2
2
Package Body Material
GLASS
METAL
Package Shape
ROUND
ROUND
Package Style
LONG FORM
LONG FORM
Polarity
UNIDIRECTIONAL
UNIDIRECTIONAL
Power Dissipation-Max
3 W
1 W
Rep Pk Reverse Voltage-Max
30.5 V
33 V
Surface Mount
NO
NO
Technology
AVALANCHE
AVALANCHE
Terminal Form
WIRE
WIRE
Terminal Position
AXIAL
AXIAL
Base Number Matches
2
1
Pbfree Code
Rohs Code
Part Package Code
DO-13
Pin Count
2
ECCN Code
EAR99
HTS Code
8541.10.00.50
Breakdown Voltage-Max
44.9 V
JEDEC-95 Code
DO-202AA
JESD-609 Code
e0
Operating Temperature-Max
175 °C
Operating Temperature-Min
-65 °C
Reference Standard
MIL-19500
Terminal Finish
TIN LEAD
Compare 1N5610E3 with alternatives
Compare MQLC33TR with alternatives