1N5543B vs JANHCA1N5543B feature comparison

1N5543B Motorola Mobility LLC

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JANHCA1N5543B Microsemi Corporation

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Rohs Code No No
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer MOTOROLA INC MICROSEMI CORP
Package Description O-LALF-W2 DIE-2
Reach Compliance Code unknown compliant
ECCN Code EAR99 EAR99
HTS Code 8541.10.00.50 8541.10.00.50
Additional Feature LOW NOISE, HIGH RELIABILITY METALLURGICALLY BONDED
Case Connection ISOLATED CATHODE
Configuration SINGLE SINGLE
Diode Element Material SILICON SILICON
Diode Type ZENER DIODE ZENER DIODE
Dynamic Impedance-Max 100 Ω 100 Ω
JEDEC-95 Code DO-204AH
JESD-30 Code O-LALF-W2 S-XXUC-N2
JESD-609 Code e0 e0
Number of Elements 1 1
Number of Terminals 2 2
Operating Temperature-Max 200 °C 175 °C
Operating Temperature-Min -65 °C
Package Body Material GLASS UNSPECIFIED
Package Shape ROUND SQUARE
Package Style LONG FORM UNCASED CHIP
Polarity UNIDIRECTIONAL UNIDIRECTIONAL
Power Dissipation-Max 0.4 W 0.5 W
Qualification Status Not Qualified Not Qualified
Reference Voltage-Nom 25 V 25 V
Reverse Current-Max 0.01 µA
Surface Mount NO YES
Technology ZENER ZENER
Terminal Finish TIN LEAD Tin/Lead (Sn/Pb)
Terminal Form WIRE NO LEAD
Terminal Position AXIAL UNSPECIFIED
Voltage Tol-Max 5% 5%
Working Test Current 1 mA 1 mA
Base Number Matches 23 4
Part Package Code DIE
Pin Count 2
Reference Standard MIL-19500/437E

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