1N5543B
vs
JANTXV1N5543B
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Active
Obsolete
Ihs Manufacturer
MICROCHIP TECHNOLOGY INC
KNOX SEMICONDUCTORS INC
Package Description
HERMETICALLY SEALED, GLASS PACKAGE-2
O-LALF-W2
Reach Compliance Code
compliant
unknown
Factory Lead Time
14 Weeks
Additional Feature
METALLURGICALLY BONDED
LOW NOISE
Case Connection
ISOLATED
ISOLATED
Configuration
SINGLE
SINGLE
Diode Element Material
SILICON
SILICON
Diode Type
ZENER DIODE
ZENER DIODE
Dynamic Impedance-Max
100 Ω
100 Ω
JEDEC-95 Code
DO-35
JESD-30 Code
O-LALF-W2
O-LALF-W2
JESD-609 Code
e0
e0
Moisture Sensitivity Level
1
Number of Elements
1
1
Number of Terminals
2
2
Operating Temperature-Max
175 °C
175 °C
Operating Temperature-Min
-65 °C
Package Body Material
GLASS
GLASS
Package Shape
ROUND
ROUND
Package Style
LONG FORM
LONG FORM
Polarity
UNIDIRECTIONAL
UNIDIRECTIONAL
Power Dissipation-Max
0.5 W
0.4 W
Qualification Status
Not Qualified
Not Qualified
Reference Standard
MIL-19500/437E
MIL-19500/437
Reference Voltage-Nom
25 V
25 V
Surface Mount
NO
NO
Technology
ZENER
ZENER
Terminal Finish
TIN LEAD
TIN LEAD
Terminal Form
WIRE
WIRE
Terminal Position
AXIAL
AXIAL
Voltage Tol-Max
5%
5%
Working Test Current
1 mA
1 mA
Base Number Matches
10
3
Pin Count
2
ECCN Code
EAR99
HTS Code
8541.10.00.50
Reverse Current-Max
0.01 µA
Voltage Temp Coeff-Max
22.5 mV/°C
Compare 1N5543B with alternatives
Compare JANTXV1N5543B with alternatives