1N5540C-1 vs 1N5540C-1 feature comparison

1N5540C-1 Cobham Semiconductor Solutions

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1N5540C-1 Microsemi Corporation

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Part Life Cycle Code Transferred Transferred
Ihs Manufacturer AEROFLEX/METELICS INC MICROSEMI CORP
Part Package Code DO-35 DO-7
Package Description O-XALF-W2 HERMETICALLY SEALED, GLASS PACKAGE-2
Pin Count 2 2
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8541.10.00.50 8541.10.00.50
Additional Feature HIGH RELIABILITY METALLURGICALLY BONDED
Case Connection ISOLATED ISOLATED
Configuration SINGLE SINGLE
Diode Element Material SILICON SILICON
Diode Type ZENER DIODE ZENER DIODE
JEDEC-95 Code DO-35 DO-35
JESD-30 Code O-XALF-W2 O-LALF-W2
JESD-609 Code e0 e0
Number of Elements 1 1
Number of Terminals 2 2
Package Body Material UNSPECIFIED GLASS
Package Shape ROUND ROUND
Package Style LONG FORM LONG FORM
Polarity UNIDIRECTIONAL UNIDIRECTIONAL
Power Dissipation-Max 0.5 W 0.5 W
Qualification Status Not Qualified Not Qualified
Reference Voltage-Nom 20 V 20 V
Surface Mount NO NO
Technology ZENER ZENER
Terminal Finish TIN LEAD TIN LEAD
Terminal Form WIRE WIRE
Terminal Position AXIAL AXIAL
Voltage Tol-Max 2% 2%
Working Test Current 1 mA 1 mA
Base Number Matches 4 10
Pbfree Code No
Rohs Code No
Dynamic Impedance-Max 100 Ω
Moisture Sensitivity Level 1
Operating Temperature-Max 175 °C
Operating Temperature-Min -65 °C
Reference Standard MIL-19500/437E

Compare 1N5540C-1 with alternatives

Compare 1N5540C-1 with alternatives