1N5371BE3/TR13
vs
1N5371BE3/TR8
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
End Of Life
Ihs Manufacturer
MICROSEMI CORP
MICROCHIP TECHNOLOGY INC
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
HTS Code
8541.10.00.50
Samacsys Manufacturer
Microsemi Corporation
Microchip
Case Connection
ISOLATED
ISOLATED
Configuration
SINGLE
SINGLE
Diode Element Material
SILICON
SILICON
Diode Type
ZENER DIODE
ZENER DIODE
Dynamic Impedance-Max
40 Ω
JEDEC-95 Code
DO-201AE
JESD-30 Code
O-PALF-W2
O-PALF-W2
Knee Impedance-Max
350 Ω
Number of Elements
1
1
Number of Terminals
2
2
Operating Temperature-Max
150 °C
150 °C
Operating Temperature-Min
-65 °C
-65 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Shape
ROUND
ROUND
Package Style
LONG FORM
LONG FORM
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Polarity
UNIDIRECTIONAL
UNIDIRECTIONAL
Power Dissipation-Max
5 W
5 W
Reference Standard
MIL-STD-750
Reference Voltage-Nom
60 V
60 V
Reverse Current-Max
0.5 µA
Reverse Test Voltage
45.5 V
Surface Mount
NO
NO
Technology
ZENER
ZENER
Terminal Form
WIRE
WIRE
Terminal Position
AXIAL
AXIAL
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Voltage Tol-Max
5%
5%
Working Test Current
20 mA
20 mA
Base Number Matches
2
2
Package Description
ROHS COMPLIANT, PLASTIC, T-18, 2 PIN
JESD-609 Code
e3
Moisture Sensitivity Level
1
Terminal Finish
Matte Tin (Sn)
Compare 1N5371BE3/TR13 with alternatives
Compare 1N5371BE3/TR8 with alternatives