1N5361BTR
vs
MX1N5361BTR
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Active
Transferred
Ihs Manufacturer
FAGOR ELECTRONICA S COOP
MICROSEMI CORP
Package Description
PLASTIC PACKAGE-2
O-PALF-W2
Pin Count
2
2
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8541.10.00.50
8541.10.00.50
Additional Feature
FORMED LEAD OPTIONS ARE AVAILABLE
Case Connection
ISOLATED
ISOLATED
Configuration
SINGLE
SINGLE
Diode Element Material
SILICON
SILICON
Diode Type
ZENER DIODE
ZENER DIODE
JEDEC-95 Code
DO-201AE
JESD-30 Code
O-PALF-W2
O-PALF-W2
JESD-609 Code
e3
e0
Knee Impedance-Max
120 Ω
Number of Elements
1
1
Number of Terminals
2
2
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Shape
ROUND
ROUND
Package Style
LONG FORM
LONG FORM
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Polarity
UNIDIRECTIONAL
UNIDIRECTIONAL
Power Dissipation-Max
5 W
5 W
Qualification Status
Not Qualified
Reference Voltage-Nom
27 V
27 V
Reverse Current-Max
0.5 µA
Surface Mount
NO
NO
Technology
ZENER
ZENER
Terminal Finish
Matte Tin (Sn)
TIN LEAD
Terminal Form
WIRE
WIRE
Terminal Position
AXIAL
AXIAL
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Voltage Tol-Max
5%
5%
Working Test Current
50 mA
50 mA
Base Number Matches
3
1
Pbfree Code
Moisture Sensitivity Level
1
Operating Temperature-Max
150 °C
Operating Temperature-Min
-65 °C
Reference Standard
MIL-19500
Compare 1N5361BTR with alternatives
Compare MX1N5361BTR with alternatives