1N5355AE3/TR13
vs
MSP1N5355ATR
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
End Of Life
Obsolete
Ihs Manufacturer
MICROCHIP TECHNOLOGY INC
MICROSEMI CORP
Reach Compliance Code
compliant
unknown
Factory Lead Time
20 Weeks
Case Connection
ISOLATED
ISOLATED
Configuration
SINGLE
SINGLE
Diode Element Material
SILICON
SILICON
Diode Type
ZENER DIODE
ZENER DIODE
Dynamic Impedance-Max
2.5 Ω
JEDEC-95 Code
DO-201AE
JESD-30 Code
O-PALF-W2
O-PALF-W2
Knee Impedance-Max
75 Ω
Number of Elements
1
1
Number of Terminals
2
2
Operating Temperature-Max
150 °C
150 °C
Operating Temperature-Min
-65 °C
-65 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Shape
ROUND
ROUND
Package Style
LONG FORM
LONG FORM
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Polarity
UNIDIRECTIONAL
UNIDIRECTIONAL
Power Dissipation-Max
5 W
5 W
Reference Standard
MIL-STD-750
Reference Voltage-Nom
18 V
18 V
Reverse Current-Max
0.5 µA
Reverse Test Voltage
13.7 V
Surface Mount
NO
NO
Technology
ZENER
ZENER
Terminal Form
WIRE
WIRE
Terminal Position
AXIAL
AXIAL
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Voltage Tol-Max
10%
10%
Working Test Current
65 mA
65 mA
Base Number Matches
2
1
Package Description
PLASTIC, T-18, 2 PIN
Pin Count
2
ECCN Code
EAR99
HTS Code
8541.10.00.50
JESD-609 Code
e0
Moisture Sensitivity Level
1
Qualification Status
Not Qualified
Terminal Finish
TIN LEAD
Compare 1N5355AE3/TR13 with alternatives
Compare MSP1N5355ATR with alternatives