1N5311
vs
JANTXV1N5311-1
feature comparison
Pbfree Code |
No
|
No
|
Rohs Code |
No
|
No
|
Part Life Cycle Code |
Obsolete
|
Transferred
|
Ihs Manufacturer |
MOTOROLA INC
|
MICROSEMI CORP
|
Package Description |
O-LALF-W2
|
DO-35, 2 PIN
|
Reach Compliance Code |
unknown
|
unknown
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8541.10.00.70
|
8541.10.00.70
|
Additional Feature |
MAXIMUM DYNAMIC IMPEDANCE IS 265K OHMS
|
METALLURGICALLY BONDED
|
Case Connection |
ISOLATED
|
ISOLATED
|
Configuration |
SINGLE
|
SINGLE
|
Diode Element Material |
SILICON
|
SILICON
|
Diode Type |
CURRENT REGULATOR DIODE
|
CURRENT REGULATOR DIODE
|
JEDEC-95 Code |
DO-204AA
|
DO-35
|
JESD-30 Code |
O-LALF-W2
|
O-XALF-W2
|
JESD-609 Code |
e0
|
e0
|
Knee Impedance-Max |
20000 Ω
|
|
Limiting Voltage-Max |
2.5 V
|
2.5 V
|
Number of Elements |
1
|
1
|
Number of Terminals |
2
|
2
|
Operating Temperature-Max |
200 °C
|
|
Operating Temperature-Min |
-55 °C
|
|
Package Body Material |
GLASS
|
UNSPECIFIED
|
Package Shape |
ROUND
|
ROUND
|
Package Style |
LONG FORM
|
LONG FORM
|
Power Dissipation-Max |
0.6 W
|
0.5 W
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Regulation Current-Nom (Ireg) |
3.6 mA
|
3.6 mA
|
Rep Pk Reverse Voltage-Max |
100 V
|
|
Surface Mount |
NO
|
NO
|
Technology |
FIELD EFFECT
|
FIELD EFFECT
|
Terminal Finish |
TIN LEAD
|
TIN LEAD
|
Terminal Form |
WIRE
|
WIRE
|
Terminal Position |
AXIAL
|
AXIAL
|
Base Number Matches |
5
|
2
|
Part Package Code |
|
DO-7
|
Pin Count |
|
2
|
Samacsys Manufacturer |
|
Microsemi Corporation
|
Reference Standard |
|
MIL-19500/463
|
|
|
|
Compare 1N5311 with alternatives
Compare JANTXV1N5311-1 with alternatives