1N5309
vs
CH1N5309
feature comparison
| Part Life Cycle Code |
Transferred
|
Obsolete
|
| Ihs Manufacturer |
M/A-COM TECHNOLOGY SOLUTIONS INC
|
MICROSEMI CORP
|
| Package Description |
GLASS PACKAGE-2
|
DIE-1
|
| Reach Compliance Code |
compliant
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8541.10.00.70
|
8541.10.00.40
|
| Case Connection |
ISOLATED
|
|
| Configuration |
SINGLE
|
SINGLE
|
| Diode Element Material |
SILICON
|
SILICON
|
| Diode Type |
CURRENT REGULATOR DIODE
|
CURRENT REGULATOR DIODE
|
| JEDEC-95 Code |
DO-7
|
|
| JESD-30 Code |
O-LALF-W2
|
S-XUUC-N1
|
| JESD-609 Code |
e0
|
e3
|
| Limiting Voltage-Max |
2.25 V
|
2.25 V
|
| Number of Elements |
1
|
1
|
| Number of Terminals |
2
|
1
|
| Package Body Material |
GLASS
|
UNSPECIFIED
|
| Package Shape |
ROUND
|
SQUARE
|
| Package Style |
LONG FORM
|
UNCASED CHIP
|
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
|
| Power Dissipation-Max |
0.5 W
|
0.475 W
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Reference Standard |
MIL-19500/463
|
|
| Regulation Current-Nom (Ireg) |
3 mA
|
3 mA
|
| Surface Mount |
NO
|
YES
|
| Technology |
FIELD EFFECT
|
FIELD EFFECT
|
| Terminal Finish |
TIN LEAD
|
TIN
|
| Terminal Form |
WIRE
|
NO LEAD
|
| Terminal Position |
AXIAL
|
UPPER
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
| Base Number Matches |
12
|
1
|
| Rohs Code |
|
No
|
| Part Package Code |
|
DIE
|
| Pin Count |
|
1
|
| Knee Impedance-Max |
|
29000 Ω
|
| Operating Temperature-Max |
|
175 °C
|
| Operating Temperature-Min |
|
-55 °C
|
| Rep Pk Reverse Voltage-Max |
|
100 V
|
|
|
|
Compare 1N5309 with alternatives
Compare CH1N5309 with alternatives