1N5307
vs
MS1N5307
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
M/A-COM TECHNOLOGY SOLUTIONS INC
MICROSEMI CORP
Package Description
GLASS PACKAGE-2
O-LALF-W2
Reach Compliance Code
compliant
unknown
ECCN Code
EAR99
EAR99
HTS Code
8541.10.00.70
8541.10.00.70
Case Connection
ISOLATED
ISOLATED
Configuration
SINGLE
SINGLE
Diode Element Material
SILICON
SILICON
Diode Type
CURRENT REGULATOR DIODE
CURRENT REGULATOR DIODE
JEDEC-95 Code
DO-7
DO-7
JESD-30 Code
O-LALF-W2
O-LALF-W2
JESD-609 Code
e0
e0
Limiting Voltage-Max
2 V
2 V
Number of Elements
1
1
Number of Terminals
2
2
Package Body Material
GLASS
GLASS
Package Shape
ROUND
ROUND
Package Style
LONG FORM
LONG FORM
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Power Dissipation-Max
0.5 W
0.475 W
Qualification Status
Not Qualified
Not Qualified
Reference Standard
MIL-19500/463
Regulation Current-Nom (Ireg)
2.4 mA
2.4 mA
Surface Mount
NO
NO
Technology
FIELD EFFECT
FIELD EFFECT
Terminal Finish
TIN LEAD
TIN LEAD
Terminal Form
WIRE
WIRE
Terminal Position
AXIAL
AXIAL
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Base Number Matches
24
1
Rohs Code
Knee Impedance-Max
44000 Ω
Operating Temperature-Max
175 °C
Operating Temperature-Min
-55 °C
Rep Pk Reverse Voltage-Max
100 V
Compare 1N5307 with alternatives
Compare MS1N5307 with alternatives