1N5305-1E3
vs
JANHCA1N5305
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
No
|
| Part Life Cycle Code |
Transferred
|
Active
|
| Ihs Manufacturer |
MICROSEMI CORP
|
MICROCHIP TECHNOLOGY INC
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
|
| Additional Feature |
HIGH SOURCE IMPEDANCE
|
|
| Case Connection |
ISOLATED
|
CATHODE
|
| Configuration |
SINGLE
|
SINGLE
|
| Diode Element Material |
SILICON
|
SILICON
|
| Diode Type |
CURRENT REGULATOR DIODE
|
CURRENT REGULATOR DIODE
|
| Dynamic Impedance-Min |
395000 Ω
|
|
| Limiting Voltage-Max |
1.85 V
|
1.85 V
|
| Number of Elements |
1
|
1
|
| Operating Temperature-Max |
175 °C
|
|
| Operating Temperature-Min |
-65 °C
|
|
| Power Dissipation-Max |
0.5 W
|
0.5 W
|
| Regulation Current-Nom (Ireg) |
2 mA
|
2 mA
|
| Rep Pk Reverse Voltage-Max |
100 V
|
100 V
|
| Surface Mount |
NO
|
YES
|
| Technology |
FIELD EFFECT
|
FIELD EFFECT
|
| Terminal Finish |
PURE MATTE TIN
|
Tin/Lead (Sn/Pb)
|
| Base Number Matches |
1
|
4
|
| Package Description |
|
HERMETIC SEALED, DIE-2
|
| JESD-30 Code |
|
S-XXUC-N2
|
| JESD-609 Code |
|
e0
|
| Number of Terminals |
|
2
|
| Package Body Material |
|
UNSPECIFIED
|
| Package Shape |
|
SQUARE
|
| Package Style |
|
UNCASED CHIP
|
| Qualification Status |
|
Qualified
|
| Reference Standard |
|
MIL-19500/463G
|
| Terminal Form |
|
NO LEAD
|
| Terminal Position |
|
UNSPECIFIED
|
|
|
|
Compare 1N5305-1E3 with alternatives
Compare JANHCA1N5305 with alternatives