1N5294BK
vs
CDLL5294
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Active
Active
Ihs Manufacturer
CENTRAL SEMICONDUCTOR CORP
MICROCHIP TECHNOLOGY INC
Part Package Code
DO-35
Package Description
HERMETIC SEALED, GLASS PACKAGE-2
HERMETIC SEALED, GLASS, LL41, MELF-2
Pin Count
2
Reach Compliance Code
not_compliant
compliant
ECCN Code
EAR99
HTS Code
8541.10.00.70
Additional Feature
HIGH RELIABILITY
METALLURGICALLY BONDED
Case Connection
ISOLATED
ISOLATED
Configuration
SINGLE
SINGLE
Diode Element Material
SILICON
SILICON
Diode Type
CURRENT REGULATOR DIODE
CURRENT REGULATOR DIODE
JEDEC-95 Code
DO-35
DO-213AB
JESD-30 Code
O-LALF-W2
O-LELF-R2
JESD-609 Code
e0
e0
Limiting Voltage-Max
1.2 V
1.2 V
Number of Elements
1
1
Number of Terminals
2
2
Operating Temperature-Max
200 °C
Operating Temperature-Min
-65 °C
Package Body Material
GLASS
GLASS
Package Shape
ROUND
ROUND
Package Style
LONG FORM
LONG FORM
Power Dissipation-Max
0.6 W
0.5 W
Qualification Status
Not Qualified
Not Qualified
Regulation Current-Nom (Ireg)
0.75 mA
0.75 mA
Rep Pk Reverse Voltage-Max
100 V
100 V
Surface Mount
NO
YES
Technology
FIELD EFFECT
FIELD EFFECT
Terminal Finish
TIN LEAD
TIN LEAD
Terminal Form
WIRE
WRAP AROUND
Terminal Position
AXIAL
END
Base Number Matches
3
2
Factory Lead Time
21 Weeks
Dynamic Impedance-Min
1150000 Ω
Compare 1N5294BK with alternatives
Compare CDLL5294 with alternatives