1N5283BK
vs
CH1N5283
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Active
Obsolete
Ihs Manufacturer
CENTRAL SEMICONDUCTOR CORP
MICROSEMI CORP
Part Package Code
DO-35
DIE
Package Description
HERMETIC SEALED, GLASS PACKAGE-2
DIE-1
Pin Count
2
1
Reach Compliance Code
not_compliant
unknown
ECCN Code
EAR99
EAR99
HTS Code
8541.10.00.70
8541.10.00.40
Additional Feature
HIGH RELIABILITY
Case Connection
ISOLATED
Configuration
SINGLE
SINGLE
Diode Element Material
SILICON
SILICON
Diode Type
CURRENT REGULATOR DIODE
CURRENT REGULATOR DIODE
JEDEC-95 Code
DO-35
JESD-30 Code
O-LALF-W2
S-XUUC-N1
JESD-609 Code
e0
e3
Limiting Voltage-Max
1 V
1 V
Number of Elements
1
1
Number of Terminals
2
1
Operating Temperature-Max
200 °C
175 °C
Operating Temperature-Min
-65 °C
-55 °C
Package Body Material
GLASS
UNSPECIFIED
Package Shape
ROUND
SQUARE
Package Style
LONG FORM
UNCASED CHIP
Power Dissipation-Max
0.6 W
0.475 W
Qualification Status
Not Qualified
Not Qualified
Regulation Current-Nom (Ireg)
0.22 mA
0.22 mA
Rep Pk Reverse Voltage-Max
100 V
100 V
Surface Mount
NO
YES
Technology
FIELD EFFECT
FIELD EFFECT
Terminal Finish
TIN LEAD
TIN
Terminal Form
WIRE
NO LEAD
Terminal Position
AXIAL
UPPER
Base Number Matches
1
1
Knee Impedance-Max
2750000 Ω
Compare 1N5283BK with alternatives
Compare CH1N5283 with alternatives