1N5261BRR1 vs MSP1N5261BTR feature comparison

1N5261BRR1 Tak Cheong Electronics (Holdings) Co Ltd

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MSP1N5261BTR Microsemi Corporation

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Rohs Code Yes No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer TAK CHEONG ELECTRONICS HOLDINGS CO LTD MICROSEMI CORP
Part Package Code DO-204 DO-7
Package Description O-LALF-W2 O-LALF-W2
Pin Count 2 2
Reach Compliance Code compliant unknown
ECCN Code EAR99 EAR99
HTS Code 8541.10.00.50 8541.10.00.50
Additional Feature METALLURGICALLY BONDED
Case Connection ISOLATED ISOLATED
Configuration SINGLE SINGLE
Diode Element Material SILICON SILICON
Diode Type ZENER DIODE ZENER DIODE
Dynamic Impedance-Max 105 Ω
JEDEC-95 Code DO-35 DO-204AA
JESD-30 Code O-LALF-W2 O-LALF-W2
Number of Elements 1 1
Number of Terminals 2 2
Operating Temperature-Max 200 °C 175 °C
Package Body Material GLASS GLASS
Package Shape ROUND ROUND
Package Style LONG FORM LONG FORM
Peak Reflow Temperature (Cel) 250
Polarity UNIDIRECTIONAL UNIDIRECTIONAL
Power Dissipation-Max 0.5 W 0.417 W
Qualification Status Not Qualified Not Qualified
Reference Voltage-Nom 47 V 47 V
Surface Mount NO NO
Technology ZENER ZENER
Terminal Form WIRE WIRE
Terminal Position AXIAL AXIAL
Voltage Tol-Max 5% 5%
Working Test Current 2.7 mA 20 mA
Base Number Matches 2 1
JESD-609 Code e0
Moisture Sensitivity Level 1
Operating Temperature-Min -65 °C
Terminal Finish TIN LEAD

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