1N5259BRA2
vs
1N5259BAMO
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
TAK CHEONG ELECTRONICS HOLDINGS CO LTD
NXP SEMICONDUCTORS
Part Package Code
DO-204
Package Description
HERMETIC SEALED, GLASS, DO-204AH, 2 PIN
Pin Count
2
Reach Compliance Code
compliant
unknown
ECCN Code
EAR99
EAR99
HTS Code
8541.10.00.50
8541.10.00.50
Additional Feature
METALLURGICALLY BONDED
Case Connection
ISOLATED
ISOLATED
Configuration
SINGLE
SINGLE
Diode Element Material
SILICON
SILICON
Diode Type
ZENER DIODE
ZENER DIODE
Dynamic Impedance-Max
80 Ω
JEDEC-95 Code
DO-35
JESD-30 Code
O-LALF-W2
O-LALF-W2
Number of Elements
1
1
Number of Terminals
2
2
Operating Temperature-Max
200 °C
200 °C
Package Body Material
GLASS
GLASS
Package Shape
ROUND
ROUND
Package Style
LONG FORM
LONG FORM
Peak Reflow Temperature (Cel)
250
Polarity
UNIDIRECTIONAL
UNIDIRECTIONAL
Power Dissipation-Max
0.5 W
0.5 W
Qualification Status
Not Qualified
Not Qualified
Reference Voltage-Nom
39 V
39 V
Surface Mount
NO
NO
Technology
ZENER
ZENER
Terminal Form
WIRE
WIRE
Terminal Position
AXIAL
AXIAL
Voltage Tol-Max
5%
5%
Working Test Current
3.2 mA
3.2 mA
Base Number Matches
1
1
Operating Temperature-Min
-65 °C
Reverse Current-Max
0.1 µA
Voltage Temp Coeff-Max
36.66 mV/°C
Compare 1N5259BRA2 with alternatives
Compare 1N5259BAMO with alternatives