1N5259B
vs
1N5259BE3TR
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Active
Obsolete
Ihs Manufacturer
MICROCHIP TECHNOLOGY INC
MICROSEMI CORP
Package Description
HERMETIC SEALED, GLASS, DO-35, 2 PIN
HERMETIC SEALED, GLASS, DO-35, 2 PIN
Reach Compliance Code
compliant
unknown
Factory Lead Time
14 Weeks
Samacsys Manufacturer
Microchip
Case Connection
ISOLATED
ISOLATED
Configuration
SINGLE
SINGLE
Diode Element Material
SILICON
SILICON
Diode Type
ZENER DIODE
ZENER DIODE
Dynamic Impedance-Max
80 Ω
JEDEC-95 Code
DO-204AH
DO-204AH
JESD-30 Code
O-LALF-W2
O-LALF-W2
JESD-609 Code
e0
e3
Moisture Sensitivity Level
1
Number of Elements
1
1
Number of Terminals
2
2
Operating Temperature-Max
200 °C
175 °C
Package Body Material
GLASS
GLASS
Package Shape
ROUND
ROUND
Package Style
LONG FORM
LONG FORM
Polarity
UNIDIRECTIONAL
UNIDIRECTIONAL
Power Dissipation-Max
0.48 W
0.48 W
Qualification Status
Not Qualified
Not Qualified
Reference Voltage-Nom
39 V
39 V
Surface Mount
NO
NO
Technology
ZENER
ZENER
Terminal Finish
TIN LEAD
TIN
Terminal Form
WIRE
WIRE
Terminal Position
AXIAL
AXIAL
Voltage Tol-Max
5%
5%
Working Test Current
3.2 mA
3.2 mA
Base Number Matches
9
9
Part Package Code
DO-35
Pin Count
2
ECCN Code
EAR99
HTS Code
8541.10.00.50
Operating Temperature-Min
-65 °C
Compare 1N5259B with alternatives
Compare 1N5259BE3TR with alternatives