1N5259B(DO-35) vs 1N5259BAMO feature comparison

1N5259B(DO-35) Microsemi Corporation

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1N5259BAMO NXP Semiconductors

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Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer MICROSEMI CORP NXP SEMICONDUCTORS
Part Package Code DO-7
Package Description HERMETIC SEALED, GLASS, DO-7, 2 PIN
Pin Count 2
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8541.10.00.50 8541.10.00.50
Case Connection ISOLATED ISOLATED
Configuration SINGLE SINGLE
Diode Element Material SILICON SILICON
Diode Type ZENER DIODE ZENER DIODE
JEDEC-95 Code DO-204AA
JESD-30 Code O-LALF-W2 O-LALF-W2
JESD-609 Code e0
Knee Impedance-Max 800 Ω
Number of Elements 1 1
Number of Terminals 2 2
Operating Temperature-Max 200 °C 200 °C
Operating Temperature-Min -65 °C -65 °C
Package Body Material GLASS GLASS
Package Shape ROUND ROUND
Package Style LONG FORM LONG FORM
Polarity UNIDIRECTIONAL UNIDIRECTIONAL
Power Dissipation-Max 0.417 W 0.5 W
Qualification Status Not Qualified Not Qualified
Reference Voltage-Nom 39 V 39 V
Reverse Current-Max 0.1 µA 0.1 µA
Surface Mount NO NO
Technology ZENER ZENER
Terminal Finish TIN LEAD
Terminal Form WIRE WIRE
Terminal Position AXIAL AXIAL
Voltage Temp Coeff-Max 36.66 mV/°C 36.66 mV/°C
Voltage Tol-Max 5% 5%
Working Test Current 3.2 mA 3.2 mA
Base Number Matches 2 1

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