1N5258BD7
vs
1N5258B-TAP
feature comparison
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Obsolete
|
Transferred
|
| Ihs Manufacturer |
MICROSEMI CORP
|
TELEFUNKEN MICROELECTRONICS GMBH
|
| Package Description |
O-XALF-W2
|
|
| Reach Compliance Code |
unknown
|
unknown
|
| ECCN Code |
EAR99
|
|
| HTS Code |
8541.10.00.50
|
|
| Case Connection |
ISOLATED
|
|
| Configuration |
SINGLE
|
SINGLE
|
| Diode Element Material |
SILICON
|
|
| Diode Type |
ZENER DIODE
|
ZENER DIODE
|
| JESD-30 Code |
O-XALF-W2
|
|
| JESD-609 Code |
e0
|
e0
|
| Knee Impedance-Max |
700 Ω
|
|
| Number of Elements |
1
|
1
|
| Number of Terminals |
2
|
|
| Operating Temperature-Max |
200 °C
|
200 °C
|
| Operating Temperature-Min |
-65 °C
|
|
| Package Body Material |
UNSPECIFIED
|
|
| Package Shape |
ROUND
|
|
| Package Style |
LONG FORM
|
|
| Polarity |
UNIDIRECTIONAL
|
|
| Power Dissipation-Max |
0.5 W
|
0.5 W
|
| Qualification Status |
Not Qualified
|
|
| Reference Voltage-Nom |
36 V
|
36 V
|
| Reverse Current-Max |
0.1 µA
|
|
| Surface Mount |
NO
|
NO
|
| Technology |
ZENER
|
|
| Terminal Finish |
TIN LEAD
|
Tin/Lead (Sn/Pb)
|
| Terminal Form |
WIRE
|
|
| Terminal Position |
AXIAL
|
|
| Voltage Temp Coeff-Max |
33.48 mV/°C
|
|
| Voltage Tol-Max |
5%
|
5%
|
| Working Test Current |
3.4 mA
|
3.4 mA
|
| Base Number Matches |
1
|
3
|
| Dynamic Impedance-Max |
|
70 Ω
|
|
|
|
Compare 1N5258BD7 with alternatives