1N5257BD7 vs MSP1N5257B-1TR feature comparison

1N5257BD7 Microsemi Corporation

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MSP1N5257B-1TR Microsemi Corporation

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Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer MICROSEMI CORP MICROSEMI CORP
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8541.10.00.50 8541.10.00.50
Case Connection ISOLATED ISOLATED
Configuration SINGLE SINGLE
Diode Element Material SILICON SILICON
Diode Type ZENER DIODE ZENER DIODE
JESD-30 Code O-XALF-W2 O-LALF-W2
JESD-609 Code e0 e0
Knee Impedance-Max 700 Ω
Number of Elements 1 1
Number of Terminals 2 2
Operating Temperature-Max 200 °C 175 °C
Operating Temperature-Min -65 °C -65 °C
Package Body Material UNSPECIFIED GLASS
Package Shape ROUND ROUND
Package Style LONG FORM LONG FORM
Polarity UNIDIRECTIONAL UNIDIRECTIONAL
Power Dissipation-Max 0.5 W 0.48 W
Qualification Status Not Qualified Not Qualified
Reference Voltage-Nom 33 V 33 V
Reverse Current-Max 0.1 µA
Surface Mount NO NO
Technology ZENER ZENER
Terminal Finish TIN LEAD TIN LEAD
Terminal Form WIRE WIRE
Terminal Position AXIAL AXIAL
Voltage Temp Coeff-Max 30.36 mV/°C
Voltage Tol-Max 5% 5%
Working Test Current 3.8 mA 20 mA
Base Number Matches 1 1
Part Package Code DO-35
Package Description HERMETIC SEALED, GLASS, DO-35, 2 PIN
Pin Count 2
JEDEC-95 Code DO-204AH
Moisture Sensitivity Level 1

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