1N5257BAMO vs MV1N5257B-1E3 feature comparison

1N5257BAMO NXP Semiconductors

Buy Now Datasheet

MV1N5257B-1E3 Microsemi Corporation

Buy Now Datasheet
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS MICROSEMI CORP
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8541.10.00.50 8541.10.00.50
Case Connection ISOLATED ISOLATED
Configuration SINGLE SINGLE
Diode Element Material SILICON SILICON
Diode Type ZENER DIODE ZENER DIODE
JESD-30 Code O-LALF-W2 O-LALF-W2
Number of Elements 1 1
Number of Terminals 2 2
Operating Temperature-Max 200 °C 175 °C
Operating Temperature-Min -65 °C -65 °C
Package Body Material GLASS GLASS
Package Shape ROUND ROUND
Package Style LONG FORM LONG FORM
Polarity UNIDIRECTIONAL UNIDIRECTIONAL
Power Dissipation-Max 0.5 W 0.48 W
Qualification Status Not Qualified Not Qualified
Reference Voltage-Nom 33 V 33 V
Reverse Current-Max 0.1 µA
Surface Mount NO NO
Technology ZENER ZENER
Terminal Form WIRE WIRE
Terminal Position AXIAL AXIAL
Voltage Temp Coeff-Max 30.36 mV/°C
Voltage Tol-Max 5% 5%
Working Test Current 3.8 mA 20 mA
Base Number Matches 1 1
Rohs Code Yes
Part Package Code DO-35
Package Description ROHS COMPLIANT, HERMETIC SEALED, GLASS, DO-35, 2 PIN
Pin Count 2
JEDEC-95 Code DO-204AH
JESD-609 Code e3
Terminal Finish MATTE TIN

Compare 1N5257BAMO with alternatives

Compare MV1N5257B-1E3 with alternatives