1N5257B153 vs MQ1N5257BE3 feature comparison

1N5257B153 NXP Semiconductors

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MQ1N5257BE3 Microsemi Corporation

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS MICROSEMI CORP
Package Description O-LALF-W2 ROHS COMPLIANT, HERMETIC SEALED, GLASS, DO-7, 2 PIN
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8541.10.00.50 8541.10.00.50
Case Connection ISOLATED ISOLATED
Configuration SINGLE SINGLE
Diode Element Material SILICON SILICON
Diode Type ZENER DIODE ZENER DIODE
JEDEC-95 Code DO-35 DO-204AA
JESD-30 Code O-LALF-W2 O-LALF-W2
Number of Elements 1 1
Number of Terminals 2 2
Operating Temperature-Max 200 °C 175 °C
Operating Temperature-Min -65 °C -65 °C
Package Body Material GLASS GLASS
Package Shape ROUND ROUND
Package Style LONG FORM LONG FORM
Polarity UNIDIRECTIONAL UNIDIRECTIONAL
Power Dissipation-Max 0.4 W 0.417 W
Qualification Status Not Qualified Not Qualified
Reference Voltage-Nom 33 V 33 V
Reverse Current-Max 0.1 µA
Surface Mount NO NO
Technology ZENER ZENER
Terminal Form WIRE WIRE
Terminal Position AXIAL AXIAL
Voltage Temp Coeff-Max 30.36 mV/°C
Voltage Tol-Max 5% 5%
Working Test Current 3.8 mA 20 mA
Base Number Matches 1 4
Rohs Code Yes
Part Package Code DO-7
Pin Count 2
JESD-609 Code e3
Moisture Sensitivity Level 1
Terminal Finish MATTE TIN

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