1N5256A
vs
MSP1N5256A-1
feature comparison
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Obsolete
|
Transferred
|
| Ihs Manufacturer |
MOTOROLA SEMICONDUCTOR PRODUCTS
|
MICROSEMI CORP
|
| Package Description |
O-LALF-W2
|
O-LALF-W2
|
| Reach Compliance Code |
unknown
|
compliant
|
| Case Connection |
ISOLATED
|
ISOLATED
|
| Configuration |
SINGLE
|
SINGLE
|
| Diode Element Material |
SILICON
|
SILICON
|
| Diode Type |
ZENER DIODE
|
ZENER DIODE
|
| Dynamic Impedance-Max |
49 Ω
|
|
| JEDEC-95 Code |
DO-204AH
|
DO-204AH
|
| JESD-30 Code |
O-LALF-W2
|
O-LALF-W2
|
| JESD-609 Code |
e0
|
e0
|
| Knee Impedance-Max |
600 Ω
|
|
| Number of Elements |
1
|
1
|
| Number of Terminals |
2
|
2
|
| Operating Temperature-Max |
200 °C
|
175 °C
|
| Operating Temperature-Min |
-65 °C
|
-65 °C
|
| Package Body Material |
GLASS
|
GLASS
|
| Package Shape |
ROUND
|
ROUND
|
| Package Style |
LONG FORM
|
LONG FORM
|
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
|
| Polarity |
UNIDIRECTIONAL
|
UNIDIRECTIONAL
|
| Power Dissipation-Max |
0.5 W
|
0.48 W
|
| Qualification Status |
Not Qualified
|
|
| Reference Voltage-Nom |
30 V
|
30 V
|
| Reverse Current-Max |
0.1 µA
|
|
| Surface Mount |
NO
|
NO
|
| Technology |
ZENER
|
ZENER
|
| Terminal Finish |
Tin/Lead (Sn/Pb)
|
TIN LEAD
|
| Terminal Form |
WIRE
|
WIRE
|
| Terminal Position |
AXIAL
|
AXIAL
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
| Voltage Temp Coeff-Max |
27.3 mV/°C
|
|
| Voltage Tol-Max |
10%
|
10%
|
| Working Test Current |
4.2 mA
|
4.2 mA
|
| Base Number Matches |
1
|
4
|
| Pbfree Code |
|
No
|
| Part Package Code |
|
DO-35
|
| Pin Count |
|
2
|
| ECCN Code |
|
EAR99
|
| HTS Code |
|
8541.10.00.50
|
| Additional Feature |
|
METALLURGICALLY BONDED
|
| Reference Standard |
|
MIL-19500
|
|
|
|
Compare 1N5256A with alternatives
Compare MSP1N5256A-1 with alternatives