1N5249BTR-RMCU
vs
MSP1N5247-1
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Active
Transferred
Ihs Manufacturer
CENTRAL SEMICONDUCTOR CORP
MICROSEMI CORP
Package Description
O-PALF-W2
O-LALF-W2
Reach Compliance Code
not_compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8541.10.00.50
8541.10.00.50
Additional Feature
INDUSTRY STANDARD
Case Connection
ISOLATED
ISOLATED
Configuration
SINGLE
SINGLE
Diode Element Material
SILICON
SILICON
Diode Type
ZENER DIODE
ZENER DIODE
JEDEC-95 Code
DO-35
DO-204AH
JESD-30 Code
O-PALF-W2
O-LALF-W2
JESD-609 Code
e0
e0
Number of Elements
1
1
Number of Terminals
2
2
Package Body Material
PLASTIC/EPOXY
GLASS
Package Shape
ROUND
ROUND
Package Style
LONG FORM
LONG FORM
Polarity
UNIDIRECTIONAL
UNIDIRECTIONAL
Power Dissipation-Max
0.5 W
0.48 W
Qualification Status
Not Qualified
Reference Voltage-Nom
19 V
17 V
Surface Mount
NO
NO
Technology
ZENER
ZENER
Terminal Finish
TIN LEAD
TIN LEAD
Terminal Form
WIRE
WIRE
Terminal Position
AXIAL
AXIAL
Base Number Matches
1
4
Part Package Code
DO-35
Pin Count
2
Operating Temperature-Max
175 °C
Operating Temperature-Min
-65 °C
Reference Standard
MIL-19500
Voltage Tol-Max
20%
Working Test Current
7.4 mA
Compare 1N5249BTR-RMCU with alternatives
Compare MSP1N5247-1 with alternatives