1N5244BUR-1
vs
MSP1N5244BUR-1E3TR
feature comparison
| Rohs Code |
No
|
Yes
|
| Part Life Cycle Code |
Active
|
Obsolete
|
| Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROSEMI CORP
|
| Reach Compliance Code |
compliant
|
unknown
|
| Factory Lead Time |
14 Weeks
|
|
| Case Connection |
ISOLATED
|
ISOLATED
|
| Configuration |
SINGLE
|
SINGLE
|
| Diode Element Material |
SILICON
|
SILICON
|
| Diode Type |
ZENER DIODE
|
ZENER DIODE
|
| Dynamic Impedance-Max |
15 Ω
|
|
| JEDEC-95 Code |
DO-213AA
|
DO-213AA
|
| JESD-30 Code |
O-LELF-R2
|
O-LELF-R2
|
| JESD-609 Code |
e0
|
e3
|
| Knee Impedance-Max |
600 Ω
|
|
| Number of Elements |
1
|
1
|
| Number of Terminals |
2
|
2
|
| Operating Temperature-Max |
175 °C
|
175 °C
|
| Operating Temperature-Min |
-65 °C
|
-65 °C
|
| Package Body Material |
GLASS
|
GLASS
|
| Package Shape |
ROUND
|
ROUND
|
| Package Style |
LONG FORM
|
LONG FORM
|
| Polarity |
UNIDIRECTIONAL
|
UNIDIRECTIONAL
|
| Power Dissipation-Max |
0.5 W
|
0.5 W
|
| Reference Standard |
MIL-STD-750
|
MIL-19500
|
| Reference Voltage-Nom |
14 V
|
14 V
|
| Reverse Current-Max |
0.1 µA
|
|
| Reverse Test Voltage |
10 V
|
|
| Surface Mount |
YES
|
YES
|
| Technology |
ZENER
|
ZENER
|
| Terminal Finish |
Tin/Lead (Sn/Pb)
|
MATTE TIN
|
| Terminal Form |
WRAP AROUND
|
WRAP AROUND
|
| Terminal Position |
END
|
END
|
| Voltage Temp Coeff-Max |
11.48 mV/°C
|
|
| Voltage Tol-Max |
5%
|
5%
|
| Working Test Current |
9 mA
|
9 mA
|
| Base Number Matches |
3
|
1
|
| Part Package Code |
|
DO-213AA
|
| Package Description |
|
O-LELF-R2
|
| Pin Count |
|
2
|
| ECCN Code |
|
EAR99
|
| HTS Code |
|
8541.10.00.50
|
| Qualification Status |
|
Not Qualified
|
|
|
|
Compare 1N5244BUR-1 with alternatives
Compare MSP1N5244BUR-1E3TR with alternatives