1N5238B
vs
MSP1N5238B-1
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
MICRO COMMERCIAL COMPONENTS CORP
MICROSEMI CORP
Part Package Code
DO-35
DO-35
Package Description
GLASS PACKAGE-2
O-LALF-W2
Pin Count
2
2
Reach Compliance Code
unknown
compliant
ECCN Code
EAR99
EAR99
HTS Code
8541.10.00.50
8541.10.00.50
Case Connection
ISOLATED
ISOLATED
Configuration
SINGLE
SINGLE
Diode Element Material
SILICON
SILICON
Diode Type
ZENER DIODE
ZENER DIODE
Dynamic Impedance-Max
8 Ω
JEDEC-95 Code
DO-35
DO-204AH
JESD-30 Code
O-LALF-W2
O-LALF-W2
JESD-609 Code
e0
e0
Knee Impedance-Max
600 Ω
Number of Elements
1
1
Number of Terminals
2
2
Operating Temperature-Max
150 °C
175 °C
Package Body Material
GLASS
GLASS
Package Shape
ROUND
ROUND
Package Style
LONG FORM
LONG FORM
Peak Reflow Temperature (Cel)
240
Polarity
UNIDIRECTIONAL
UNIDIRECTIONAL
Power Dissipation-Max
0.5 W
0.48 W
Qualification Status
Not Qualified
Reference Voltage-Nom
8.7 V
8.7 V
Reverse Current-Max
0.003 µA
Surface Mount
NO
NO
Technology
ZENER
ZENER
Terminal Finish
TIN LEAD
TIN LEAD
Terminal Form
WIRE
WIRE
Terminal Position
AXIAL
AXIAL
Time@Peak Reflow Temperature-Max (s)
30
Voltage Tol-Max
5%
5%
Working Test Current
20 mA
20 mA
Base Number Matches
13
4
Additional Feature
METALLURGICALLY BONDED
Operating Temperature-Min
-65 °C
Reference Standard
MIL-19500
Compare 1N5238B with alternatives
Compare MSP1N5238B-1 with alternatives