1N5229B-1E3
vs
1N5229BG
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Active
Obsolete
Ihs Manufacturer
MICROCHIP TECHNOLOGY INC
TAK CHEONG ELECTRONICS HOLDINGS CO LTD
Package Description
ROHS COMPLIANT, HERMETIC SEALED, GLASS, DO-35, 2 PIN
O-LALF-W2
Reach Compliance Code
compliant
unknown
Factory Lead Time
14 Weeks
Samacsys Manufacturer
Microchip
Additional Feature
METALLURGICALLY BONDED
METALLURGICALLY BONDED
Case Connection
ISOLATED
ISOLATED
Configuration
SINGLE
SINGLE
Diode Element Material
SILICON
SILICON
Diode Type
ZENER DIODE
ZENER DIODE
Dynamic Impedance-Max
22 Ω
JEDEC-95 Code
DO-204AH
DO-35
JESD-30 Code
O-LALF-W2
O-LALF-W2
JESD-609 Code
e3
e0
Number of Elements
1
1
Number of Terminals
2
2
Operating Temperature-Max
175 °C
200 °C
Operating Temperature-Min
-65 °C
-65 °C
Package Body Material
GLASS
GLASS
Package Shape
ROUND
ROUND
Package Style
LONG FORM
LONG FORM
Polarity
UNIDIRECTIONAL
UNIDIRECTIONAL
Power Dissipation-Max
0.48 W
0.5 W
Qualification Status
Not Qualified
Not Qualified
Reference Voltage-Nom
4.3 V
4.3 V
Surface Mount
NO
NO
Technology
ZENER
ZENER
Terminal Finish
Matte Tin (Sn)
TIN LEAD
Terminal Form
WIRE
WIRE
Terminal Position
AXIAL
AXIAL
Voltage Tol-Max
5%
5%
Working Test Current
20 mA
20 mA
Base Number Matches
2
1
Part Package Code
DO-204
Pin Count
2
ECCN Code
EAR99
HTS Code
8541.10.00.50
Compare 1N5229B-1E3 with alternatives
Compare 1N5229BG with alternatives