1N5226S vs MSP1N5236DUR-1E3 feature comparison

1N5226S TDK Micronas GmbH

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MSP1N5236DUR-1E3 Microsemi Corporation

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer ITT SEMICONDUCTOR MICROSEMI CORP
Package Description O-LALF-W2 O-LELF-R2
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8541.10.00.50 8541.10.00.50
Case Connection ISOLATED ISOLATED
Configuration SINGLE SINGLE
Diode Element Material SILICON SILICON
Diode Type ZENER DIODE ZENER DIODE
JESD-30 Code O-LALF-W2 O-LELF-R2
Knee Impedance-Max 1600 Ω
Number of Elements 1 1
Number of Terminals 2 2
Package Body Material GLASS GLASS
Package Shape ROUND ROUND
Package Style LONG FORM LONG FORM
Polarity UNIDIRECTIONAL UNIDIRECTIONAL
Power Dissipation-Max 0.5 W 0.5 W
Qualification Status Not Qualified Not Qualified
Reference Voltage-Nom 3.3 V 7.5 V
Surface Mount NO YES
Technology ZENER ZENER
Terminal Form WIRE WRAP AROUND
Terminal Position AXIAL END
Voltage Temp Coeff-Max
Voltage Tol-Max 20% 1%
Working Test Current 20 mA 20 mA
Base Number Matches 3 2
Rohs Code Yes
Part Package Code DO-213AA
Pin Count 2
JEDEC-95 Code DO-213AA
JESD-609 Code e3
Operating Temperature-Max 175 °C
Operating Temperature-Min -65 °C
Reference Standard MIL-19500
Terminal Finish MATTE TIN

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