1N5226BBK
vs
1N5226BE3
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Active
Active
Ihs Manufacturer
CENTRAL SEMICONDUCTOR CORP
MICROCHIP TECHNOLOGY INC
Reach Compliance Code
not_compliant
compliant
ECCN Code
EAR99
HTS Code
8541.10.00.50
Case Connection
ISOLATED
ISOLATED
Configuration
SINGLE
SINGLE
Diode Element Material
SILICON
SILICON
Diode Type
ZENER DIODE
ZENER DIODE
Dynamic Impedance-Max
28 Ω
JEDEC-95 Code
DO-35
DO-204AH
JESD-30 Code
O-PALF-W2
O-LALF-W2
JESD-609 Code
e0
e3
Knee Impedance-Max
1600 Ω
Number of Elements
1
1
Number of Terminals
2
2
Operating Temperature-Max
200 °C
175 °C
Operating Temperature-Min
-65 °C
-65 °C
Package Body Material
PLASTIC/EPOXY
GLASS
Package Shape
ROUND
ROUND
Package Style
LONG FORM
LONG FORM
Polarity
UNIDIRECTIONAL
UNIDIRECTIONAL
Power Dissipation-Max
0.5 W
0.48 W
Qualification Status
Not Qualified
Reference Voltage-Nom
3.3 V
3.3 V
Reverse Current-Max
25 µA
Reverse Test Voltage
1 V
Surface Mount
NO
NO
Technology
ZENER
ZENER
Terminal Finish
TIN LEAD
MATTE TIN
Terminal Form
WIRE
WIRE
Terminal Position
AXIAL
AXIAL
Voltage Temp Coeff-Max
-2.31 mV/°C
Voltage Tol-Max
5%
5%
Working Test Current
20 mA
20 mA
Base Number Matches
1
2
Package Description
ROHS COMPLIANT, HERMETIC SEALED, GLASS, DO-35, 2 PIN
Factory Lead Time
14 Weeks
Compare 1N5226BBK with alternatives
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