1N5225BTIN/LEAD
vs
1N5225BBKPBFREE
feature comparison
All Stats
Differences Only
Rohs Code
No
Part Life Cycle Code
Active
Active
Ihs Manufacturer
CENTRAL SEMICONDUCTOR CORP
CENTRAL SEMICONDUCTOR CORP
Reach Compliance Code
not_compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8541.10.00.50
8541.10.00.50
Date Of Intro
2018-03-29
Additional Feature
HIGH RELIABILITY
Case Connection
ISOLATED
ISOLATED
Configuration
SINGLE
Diode Element Material
SILICON
SILICON
Diode Type
ZENER DIODE
ZENER DIODE
Dynamic Impedance-Max
29 Ω
JEDEC-95 Code
DO-35
DO-35
JESD-30 Code
O-PALF-W2
O-PALF-W2
JESD-609 Code
e0
e3
Knee Impedance-Max
1600 Ω
Number of Elements
1
1
Number of Terminals
2
2
Operating Temperature-Max
200 °C
Operating Temperature-Min
-65 °C
Package Body Material
PLASTIC/EPOXY
UNSPECIFIED
Package Shape
ROUND
ROUND
Package Style
LONG FORM
LONG FORM
Polarity
UNIDIRECTIONAL
UNIDIRECTIONAL
Power Dissipation-Max
0.5 W
0.5 W
Reference Voltage-Nom
3 V
3 V
Reverse Current-Max
50 µA
Reverse Test Voltage
1 V
Surface Mount
NO
NO
Technology
ZENER
ZENER
Terminal Finish
TIN LEAD
MATTE TIN
Terminal Form
WIRE
WIRE
Terminal Position
AXIAL
AXIAL
Voltage Temp Coeff-Max
-2.25 mV/°C
Voltage Tol-Max
5%
Working Test Current
20 mA
Base Number Matches
1
1
Peak Reflow Temperature (Cel)
260
Compare 1N5225BTIN/LEAD with alternatives
Compare 1N5225BBKPBFREE with alternatives