1N5225B153 vs 1N5225BTR feature comparison

1N5225B153 NXP Semiconductors

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1N5225BTR Microsemi Corporation

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS MICROSEMI CORP
Package Description O-LALF-W2 HERMETIC SEALED, GLASS, DO-35, 2 PIN
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8541.10.00.50 8541.10.00.50
Case Connection ISOLATED ISOLATED
Configuration SINGLE SINGLE
Diode Element Material SILICON SILICON
Diode Type ZENER DIODE ZENER DIODE
JEDEC-95 Code DO-35 DO-204AH
JESD-30 Code O-LALF-W2 O-LALF-W2
Number of Elements 1 1
Number of Terminals 2 2
Operating Temperature-Max 200 °C 175 °C
Operating Temperature-Min -65 °C
Package Body Material GLASS GLASS
Package Shape ROUND ROUND
Package Style LONG FORM LONG FORM
Polarity UNIDIRECTIONAL UNIDIRECTIONAL
Power Dissipation-Max 0.4 W 0.48 W
Qualification Status Not Qualified Not Qualified
Reference Voltage-Nom 3 V 3 V
Reverse Current-Max 50 µA
Surface Mount NO NO
Technology ZENER ZENER
Terminal Form WIRE WIRE
Terminal Position AXIAL AXIAL
Voltage Temp Coeff-Max -2.25 mV/°C
Voltage Tol-Max 5% 5%
Working Test Current 20 mA 20 mA
Base Number Matches 1 2
Rohs Code No
Part Package Code DO-35
Pin Count 2
Dynamic Impedance-Max 29 Ω
JESD-609 Code e0
Moisture Sensitivity Level 1
Terminal Finish TIN LEAD

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