1N5088
vs
UZ760HR
feature comparison
| Pbfree Code |
No
|
|
| Rohs Code |
No
|
|
| Part Life Cycle Code |
Transferred
|
|
| Ihs Manufacturer |
MICROSEMI CORP
|
|
| Package Description |
HERMETIC SEALED, MICRO MINIATURE, GLASS PACKAGE-2
|
|
| Pin Count |
2
|
|
| Reach Compliance Code |
not_compliant
|
|
| ECCN Code |
EAR99
|
|
| HTS Code |
8541.10.00.50
|
|
| Additional Feature |
METALLURGICALLY BONDED
|
|
| Case Connection |
ISOLATED
|
|
| Configuration |
SINGLE
|
|
| Diode Element Material |
SILICON
|
|
| Diode Type |
ZENER DIODE
|
|
| Dynamic Impedance-Max |
70 Ω
|
|
| JESD-30 Code |
O-LALF-W2
|
|
| JESD-609 Code |
e0
|
|
| Number of Elements |
1
|
|
| Number of Terminals |
2
|
|
| Operating Temperature-Max |
175 °C
|
|
| Operating Temperature-Min |
-65 °C
|
|
| Package Body Material |
GLASS
|
|
| Package Shape |
ROUND
|
|
| Package Style |
LONG FORM
|
|
| Polarity |
UNIDIRECTIONAL
|
|
| Power Dissipation-Max |
3 W
|
|
| Qualification Status |
Not Qualified
|
|
| Reference Voltage-Nom |
60 V
|
|
| Reverse Current-Max |
1 µA
|
|
| Surface Mount |
NO
|
|
| Technology |
ZENER
|
|
| Terminal Finish |
TIN LEAD
|
|
| Terminal Form |
WIRE
|
|
| Terminal Position |
AXIAL
|
|
| Voltage Temp Coeff-Max |
57 mV/°C
|
|
| Voltage Tol-Max |
5%
|
|
| Working Test Current |
10 mA
|
|
| Base Number Matches |
1
|
|
|
|
|
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