1N5060
vs
RS2G
feature comparison
| Part Life Cycle Code |
Active
|
Contact Manufacturer
|
| Ihs Manufacturer |
TOSHIBA CORP
|
HY ELECTRONIC CORP
|
| Part Package Code |
DO-41
|
|
| Package Description |
GLASS PACKAGE-2
|
SMB, 2 PIN
|
| Pin Count |
2
|
|
| Reach Compliance Code |
unknown
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8541.10.00.80
|
8541.10.00.80
|
| Case Connection |
ISOLATED
|
|
| Configuration |
SINGLE
|
SINGLE
|
| Diode Element Material |
SILICON
|
SILICON
|
| Diode Type |
RECTIFIER DIODE
|
RECTIFIER DIODE
|
| Forward Voltage-Max (VF) |
1.2 V
|
1.3 V
|
| JEDEC-95 Code |
DO-41
|
|
| JESD-30 Code |
O-LALF-W2
|
R-PDSO-C2
|
| Non-rep Pk Forward Current-Max |
50 A
|
60 A
|
| Number of Elements |
1
|
1
|
| Number of Phases |
1
|
1
|
| Number of Terminals |
2
|
2
|
| Operating Temperature-Max |
150 °C
|
150 °C
|
| Output Current-Max |
1 A
|
2 A
|
| Package Body Material |
GLASS
|
PLASTIC/EPOXY
|
| Package Shape |
ROUND
|
RECTANGULAR
|
| Package Style |
LONG FORM
|
SMALL OUTLINE
|
| Qualification Status |
Not Qualified
|
|
| Rep Pk Reverse Voltage-Max |
400 V
|
400 V
|
| Surface Mount |
NO
|
YES
|
| Terminal Form |
WIRE
|
C BEND
|
| Terminal Position |
AXIAL
|
DUAL
|
| Base Number Matches |
25
|
23
|
| Application |
|
EFFICIENCY
|
| Operating Temperature-Min |
|
-55 °C
|
| Reverse Current-Max |
|
5 µA
|
| Reverse Recovery Time-Max |
|
0.15 µs
|
|
|
|
Compare 1N5060 with alternatives
Compare RS2G with alternatives