1N4967US vs JAN1N4967US feature comparison

1N4967US Microsemi Corporation

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JAN1N4967US Microchip Technology Inc

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Pbfree Code No
Rohs Code No No
Part Life Cycle Code Transferred Active
Ihs Manufacturer MICROSEMI CORP MICROCHIP TECHNOLOGY INC
Package Description HERMETIC SEALED, GLASS, D58, 2 PIN
Pin Count 2
Reach Compliance Code unknown compliant
ECCN Code EAR99
HTS Code 8541.10.00.50
Additional Feature HIGH RELIABILITY
Case Connection ISOLATED ISOLATED
Configuration SINGLE SINGLE
Diode Element Material SILICON SILICON
Diode Type ZENER DIODE ZENER DIODE
JESD-30 Code O-LELF-R2 O-LELF-R2
JESD-609 Code e0 e0
Number of Elements 1 1
Number of Terminals 2 2
Package Body Material GLASS GLASS
Package Shape RECTANGULAR ROUND
Package Style FLANGE MOUNT LONG FORM
Polarity UNIDIRECTIONAL UNIDIRECTIONAL
Power Dissipation-Max 5 W 5 W
Qualification Status Not Qualified Qualified
Reference Voltage-Nom 24 V 24 V
Surface Mount YES YES
Technology ZENER ZENER
Terminal Finish TIN LEAD TIN LEAD
Terminal Form SOLDER LUG WRAP AROUND
Terminal Position UPPER END
Voltage Tol-Max 5% 5%
Working Test Current 50 mA 50 mA
Base Number Matches 7 1
Factory Lead Time 28 Weeks
Dynamic Impedance-Max 3 Ω
Operating Temperature-Max 200 °C
Reference Standard MIL-19500/356H

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