1N4967US
vs
JAN1N4967US
feature comparison
All Stats
Differences Only
Pbfree Code
No
Rohs Code
No
No
Part Life Cycle Code
Transferred
Active
Ihs Manufacturer
MICROSEMI CORP
MICROCHIP TECHNOLOGY INC
Package Description
HERMETIC SEALED, GLASS, D58, 2 PIN
Pin Count
2
Reach Compliance Code
unknown
compliant
ECCN Code
EAR99
HTS Code
8541.10.00.50
Additional Feature
HIGH RELIABILITY
Case Connection
ISOLATED
ISOLATED
Configuration
SINGLE
SINGLE
Diode Element Material
SILICON
SILICON
Diode Type
ZENER DIODE
ZENER DIODE
JESD-30 Code
O-LELF-R2
O-LELF-R2
JESD-609 Code
e0
e0
Number of Elements
1
1
Number of Terminals
2
2
Package Body Material
GLASS
GLASS
Package Shape
RECTANGULAR
ROUND
Package Style
FLANGE MOUNT
LONG FORM
Polarity
UNIDIRECTIONAL
UNIDIRECTIONAL
Power Dissipation-Max
5 W
5 W
Qualification Status
Not Qualified
Qualified
Reference Voltage-Nom
24 V
24 V
Surface Mount
YES
YES
Technology
ZENER
ZENER
Terminal Finish
TIN LEAD
TIN LEAD
Terminal Form
SOLDER LUG
WRAP AROUND
Terminal Position
UPPER
END
Voltage Tol-Max
5%
5%
Working Test Current
50 mA
50 mA
Base Number Matches
7
1
Factory Lead Time
28 Weeks
Dynamic Impedance-Max
3 Ω
Operating Temperature-Max
200 °C
Reference Standard
MIL-19500/356H
Compare 1N4967US with alternatives
Compare JAN1N4967US with alternatives