1N4967
vs
JANS1N4967
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Active
Ihs Manufacturer
SEMTECH CORP
MICROCHIP TECHNOLOGY INC
Package Description
HERMETIC SEALED PACKAGE-2
HERMETIC SEALED, GLASS PACKAGE-2
Pin Count
2
Reach Compliance Code
unknown
compliant
ECCN Code
EAR99
HTS Code
8541.10.00.50
Additional Feature
LOW DYNAMIC IMPEDANCE
Case Connection
ISOLATED
ISOLATED
Configuration
SINGLE
SINGLE
Diode Element Material
SILICON
SILICON
Diode Type
ZENER DIODE
ZENER DIODE
Dynamic Impedance-Max
3 Ω
JESD-30 Code
O-XALF-W2
O-LALF-W2
JESD-609 Code
e0
e0
Number of Elements
1
1
Number of Terminals
2
2
Operating Temperature-Max
200 °C
Package Body Material
UNSPECIFIED
GLASS
Package Shape
ROUND
ROUND
Package Style
LONG FORM
LONG FORM
Polarity
UNIDIRECTIONAL
UNIDIRECTIONAL
Power Dissipation-Max
5 W
5 W
Qualification Status
Not Qualified
Qualified
Reference Voltage-Nom
24 V
24 V
Reverse Current-Max
2 µA
Surface Mount
NO
NO
Technology
ZENER
ZENER
Terminal Finish
TIN LEAD
TIN LEAD
Terminal Form
WIRE
WIRE
Terminal Position
AXIAL
AXIAL
Voltage Temp Coeff-Max
21.6 mV/°C
Voltage Tol-Max
5%
5%
Working Test Current
50 mA
50 mA
Base Number Matches
11
8
Factory Lead Time
32 Weeks
Reference Standard
MIL-19500/356H
Compare 1N4967 with alternatives
Compare JANS1N4967 with alternatives