1N4963
vs
JAN1N4963
feature comparison
All Stats
Differences Only
Rohs Code
No
No
Part Life Cycle Code
Active
Active
Ihs Manufacturer
MICROCHIP TECHNOLOGY INC
MICROCHIP TECHNOLOGY INC
Package Description
HERMETIC SEALED, PLASTIC, E PACKAGE-2
HERMETIC SEALED, GLASS PACKAGE-2
Reach Compliance Code
compliant
compliant
Factory Lead Time
28 Weeks
28 Weeks
Additional Feature
HIGH RELIABILITY
HIGH RELIABILITY
Case Connection
ISOLATED
ISOLATED
Configuration
SINGLE
SINGLE
Diode Element Material
SILICON
SILICON
Diode Type
ZENER DIODE
ZENER DIODE
Dynamic Impedance-Max
2.5 Ω
2.5 Ω
JESD-30 Code
O-LALF-W2
O-LALF-W2
JESD-609 Code
e0
e0
Number of Elements
1
1
Number of Terminals
2
2
Operating Temperature-Max
200 °C
200 °C
Package Body Material
GLASS
GLASS
Package Shape
ROUND
ROUND
Package Style
LONG FORM
LONG FORM
Polarity
UNIDIRECTIONAL
UNIDIRECTIONAL
Power Dissipation-Max
0.5 W
5 W
Qualification Status
Not Qualified
Qualified
Reference Voltage-Nom
16 V
16 V
Surface Mount
NO
NO
Technology
ZENER
ZENER
Terminal Finish
TIN LEAD
TIN LEAD
Terminal Form
WIRE
WIRE
Terminal Position
AXIAL
AXIAL
Voltage Tol-Max
5%
5%
Working Test Current
75 mA
75 mA
Base Number Matches
29
7
Knee Impedance-Max
155 Ω
Operating Temperature-Min
-65 °C
Reference Standard
MIL-19500/356H
Reverse Current-Max
5 µA
Voltage Temp Coeff-Max
12.8 mV/°C
Compare 1N4963 with alternatives
Compare JAN1N4963 with alternatives