1N4922
vs
1N4922E3
feature comparison
All Stats
Differences Only
Rohs Code
No
Part Life Cycle Code
Active
Transferred
Ihs Manufacturer
MICROCHIP TECHNOLOGY INC
MICROSEMI CORP
Package Description
HERMETIC SEALED, GLASS PACAKGE-2
O-LALF-W2
Reach Compliance Code
compliant
compliant
Factory Lead Time
26 Weeks
Additional Feature
LOW NOISE
LOW NOISE
Case Connection
ISOLATED
ISOLATED
Configuration
SINGLE
SINGLE
Diode Element Material
SILICON
SILICON
Diode Type
ZENER DIODE
ZENER DIODE
JEDEC-95 Code
DO-35
DO-35
JESD-30 Code
O-LALF-W2
O-LALF-W2
JESD-609 Code
e0
Number of Elements
1
1
Number of Terminals
2
2
Operating Temperature-Max
175 °C
Operating Temperature-Min
-65 °C
Package Body Material
GLASS
GLASS
Package Shape
ROUND
ROUND
Package Style
LONG FORM
LONG FORM
Power Dissipation-Max
0.5 W
0.5 W
Qualification Status
Not Qualified
Reference Voltage-Nom
19.2 V
19.2 V
Surface Mount
NO
NO
Technology
ZENER
ZENER
Terminal Finish
TIN LEAD
Terminal Form
WIRE
WIRE
Terminal Position
AXIAL
AXIAL
Voltage Temp Coeff-Max
1.92 mV/°C
1.92 mV/°C
Voltage Tol-Max
5%
5%
Base Number Matches
6
1
ECCN Code
EAR99
HTS Code
8541.10.00.50