1N4752ARL vs MSP1N4752AP feature comparison

1N4752ARL Motorola Semiconductor Products

Buy Now Datasheet

MSP1N4752AP Microsemi Corporation

Buy Now Datasheet
Rohs Code No No
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer MOTOROLA INC MICROSEMI CORP
Package Description GLASS, CASE 59-03, 2 PIN O-PALF-W2
Reach Compliance Code unknown compliant
ECCN Code EAR99 EAR99
HTS Code 8541.10.00.50 8541.10.00.50
Additional Feature METALLURGICALLY BONDED
Case Connection ISOLATED ISOLATED
Configuration SINGLE SINGLE
Diode Element Material SILICON SILICON
Diode Type ZENER DIODE ZENER DIODE
JEDEC-95 Code DO-41 DO-204AL
JESD-30 Code O-LALF-W2 O-PALF-W2
JESD-609 Code e0 e0
Knee Impedance-Max 1000 Ω
Number of Elements 1 1
Number of Terminals 2 2
Operating Temperature-Max 200 °C 150 °C
Operating Temperature-Min -65 °C -65 °C
Package Body Material GLASS PLASTIC/EPOXY
Package Shape ROUND ROUND
Package Style LONG FORM LONG FORM
Polarity UNIDIRECTIONAL UNIDIRECTIONAL
Power Dissipation-Max 1 W 1 W
Qualification Status Not Qualified
Reference Voltage-Nom 33 V 33 V
Reverse Current-Max 5 µA
Surface Mount NO NO
Technology ZENER ZENER
Terminal Finish Tin/Lead (Sn/Pb) TIN LEAD
Terminal Form WIRE WIRE
Terminal Position AXIAL AXIAL
Voltage Tol-Max 5% 5%
Working Test Current 7.5 mA 7.5 mA
Base Number Matches 5 1
Pbfree Code No
Part Package Code DO-41
Pin Count 2
Reference Standard MIL-19500

Compare MSP1N4752AP with alternatives