1N4751A-GT3 vs 1N3031B-1 feature comparison

1N4751A-GT3 Sangdest Microelectronics (Nanjing) Co Ltd

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1N3031B-1 Microsemi Corporation

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Rohs Code Yes No
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer SANGDEST MICROELECTRONICS (NANJING) CO LTD MICROSEMI CORP
Package Description O-LALF-W2 HERMETIC SEALED, GLASS PACKAGE-1
Reach Compliance Code unknown unknown
Case Connection ISOLATED ISOLATED
Configuration SINGLE SINGLE
Diode Element Material SILICON SILICON
Diode Type ZENER DIODE ZENER DIODE
JEDEC-95 Code DO-41 DO-41
JESD-30 Code O-LALF-W2 O-LALF-W2
Number of Elements 1 1
Number of Terminals 2 2
Package Body Material GLASS GLASS
Package Shape ROUND ROUND
Package Style LONG FORM LONG FORM
Peak Reflow Temperature (Cel) NOT SPECIFIED
Polarity UNIDIRECTIONAL UNIDIRECTIONAL
Power Dissipation-Max 1 W 1 W
Qualification Status Not Qualified Not Qualified
Reference Voltage-Nom 30 V 30 V
Surface Mount NO NO
Technology ZENER ZENER
Terminal Form WIRE WIRE
Terminal Position AXIAL AXIAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Voltage Tol-Max 5% 5%
Working Test Current 8.5 mA 8.5 mA
Base Number Matches 2 4
Pbfree Code No
Part Package Code DO-41
Pin Count 1
ECCN Code EAR99
HTS Code 8541.10.00.50
Additional Feature METALLURGICALLY BONDED
Dynamic Impedance-Max 40 Ω
JESD-609 Code e0
Operating Temperature-Max 175 °C
Terminal Finish TIN LEAD

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