1N4747A
vs
MQ1N4747AP
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
NXP SEMICONDUCTORS
MICROSEMI CORP
Part Package Code
DO-41
DO-41
Package Description
HERMETIC SEALED, GLASS PACKAGE-2
O-PALF-W2
Pin Count
2
2
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8541.10.00.50
8541.10.00.50
Samacsys Manufacturer
NXP
Case Connection
ISOLATED
ISOLATED
Configuration
SINGLE
SINGLE
Diode Element Material
SILICON
SILICON
Diode Type
ZENER DIODE
ZENER DIODE
Dynamic Impedance-Max
22 Ω
JEDEC-95 Code
DO-41
DO-204AL
JESD-30 Code
O-LALF-W2
O-PALF-W2
JESD-609 Code
e3
e0
Knee Impedance-Max
750 Ω
Moisture Sensitivity Level
1
Number of Elements
1
1
Number of Terminals
2
2
Operating Temperature-Max
200 °C
150 °C
Operating Temperature-Min
-65 °C
-65 °C
Package Body Material
GLASS
PLASTIC/EPOXY
Package Shape
ROUND
ROUND
Package Style
LONG FORM
LONG FORM
Peak Reflow Temperature (Cel)
260
Polarity
UNIDIRECTIONAL
UNIDIRECTIONAL
Power Dissipation-Max
1 W
1 W
Qualification Status
Not Qualified
Reference Voltage-Nom
20 V
20 V
Reverse Current-Max
5 µA
Surface Mount
NO
NO
Technology
ZENER
ZENER
Terminal Finish
Tin (Sn)
TIN LEAD
Terminal Form
WIRE
WIRE
Terminal Position
AXIAL
AXIAL
Time@Peak Reflow Temperature-Max (s)
30
Voltage Tol-Max
5%
5%
Working Test Current
12.5 mA
12.5 mA
Base Number Matches
6
4
Reference Standard
MIL-19500
Compare 1N4747A with alternatives
Compare MQ1N4747AP with alternatives